PMC

Comparisons of corneal parameters in KC and control groups. (A) IOP between eye rubbing and non-eye rubbing; (B) IOP between atopy and non-atopy; (C) Kf between eye rubbing and non-eye rubbing; (D) Kf between atopy and non-atopy; (E) Ks between eye rubbing and non-eye rubbing; (F) Ks between atopy and non-atopy; (G) Kmax between eye rubbing and non-eye rubbing;(H) Kmax between atopy and non-atopy; (I) TCT between eye rubbing and non-eye rubbing; (J) TCT between atopy and non-atopy.

(a) SEM image of sandpaper’s surface after a round of soft contact rubbing (scale bar, 20 μm). (b) SEM image of sandpaper’s surface after 100 seconds PET-sandpaper rubbing (scale bar, 20 μm). (c) SEM image of sandpaper’s surface after 200 seconds Si smoothing rubbing (scale bar, 20 μm). (d) SEM image of smooth region on sandpaper’s surface, after a round of soft contact rubbing (scale bar, 1 μm). (e) SEM image of smooth region on sandpaper’s surface, after 100 seconds PET-sandpaper rubbing (scale bar, 1 μm). (f) SEM image of smooth region on sandpaper’s surface, after 200 seconds Si smoothing rubbing (scale bar, 1 μm). (g) Smoothness of smooth region on sandpaper’s surface as a function of Restoring Smoothing Rubbing process flow. (Point in red cycle: smoothness of smooth region on sandpaper’s surface after a round of soft contact rubbing. Point in green cycle: smoothness of smooth region on sandpaper’s surface after 100 seconds PET-sandpaper rubbing. Point in blue cycle: smoothness of smooth region on sandpaper’s surface after 200 seconds Si smoothing rubbing.)

Representative micrographs of resin-enamel interfaces for the different strategies (PA and GA etching; rubbing and no rubbing) and of three adhesive systems (SB, OSP, and SBU). (a) PA no rubbing and SB. (b) PA rubbing and SB. (c) GA no rubbing and SB. (d) GA rubbing and SB. (e) PA no rubbing and OSP. (f) PA rubbing and OSP. (g) GA no rubbing and OSP. (h) GA rubbing and OSP. (i) PA no rubbing and SBU. (j) PA rubbing and SBU. (k) GA no rubbing and SBU. (l) GA rubbing and SBU. A = adhesive layer; C = composite resin; E = enamel; the adhesive/enamel interface is indicated by arrows.

Micrographs of resin-dentin interfaces for the different strategies (PA and GA etching; rubbing and no rubbing) and of three adhesive systems (SB, OSP, and SBU). (a) PA no rubbing and SB. (b) PA rubbing and SB. (c) GA no rubbing and SB. (d) GA rubbing and SB. (e) PA no rubbing and OSP. (f) PA rubbing and OSP. (g) GA no rubbing and OSP. (h) GA rubbing and OSP. (i) PA no rubbing and SBU. (j) PA rubbing and SBU. (k) GA no rubbing and SBU. (l) GA rubbing and SBU. A = adhesive layer; C = composite resin; D = dentin; H = hybrid layer; T = resin tag.