Similar articles for PMID: 31042348

Year	Number of Results
1985	1
1987	1
1989	3
1990	5
1991	2
1992	1
1993	7
1994	7
1995	4
1996	2
2005	1
2008	1
2009	4
2010	2
2011	2
2012	6
2013	6
2014	7
2015	11
2016	9
2017	23
2018	21
2019	23
2020	25
2021	19
2022	25
2023	7
2024	0

1

Tunable Thermal Energy Transport across Diamond Membranes and Diamond-Si Interfaces by Nanoscale Graphoepitaxy.

Cheng Z, Bai T, Shi J, Feng T, Wang Y, Mecklenburg M, Li C, Hobart KD, Feygelson TI, Tadjer MJ, Pate BB, Foley BM, Yates L, Pantelides ST, Cola BA, Goorsky M, Graham S. Cheng Z, et al. ACS Appl Mater Interfaces. 2019 May 22;11(20):18517-18527. doi: 10.1021/acsami.9b02234. Epub 2019 May 13. ACS Appl Mater Interfaces. 2019. PMID: 31042348

2

Interfacial Thermal Conductance across Room-Temperature-Bonded GaN/Diamond Interfaces for GaN-on-Diamond Devices.

Cheng Z, Mu F, Yates L, Suga T, Graham S. Cheng Z, et al. ACS Appl Mater Interfaces. 2020 Feb 19;12(7):8376-8384. doi: 10.1021/acsami.9b16959. Epub 2020 Feb 10. ACS Appl Mater Interfaces. 2020. PMID: 31986013

3

Probing Growth-Induced Anisotropic Thermal Transport in High-Quality CVD Diamond Membranes by Multifrequency and Multiple-Spot-Size Time-Domain Thermoreflectance.

Cheng Z, Bougher T, Bai T, Wang SY, Li C, Yates L, Foley BM, Goorsky M, Cola BA, Faili F, Graham S. Cheng Z, et al. ACS Appl Mater Interfaces. 2018 Feb 7;10(5):4808-4815. doi: 10.1021/acsami.7b16812. Epub 2018 Jan 25. ACS Appl Mater Interfaces. 2018. PMID: 29328632

4

High Thermal Boundary Conductance across Bonded Heterogeneous GaN-SiC Interfaces.

Mu F, Cheng Z, Shi J, Shin S, Xu B, Shiomi J, Graham S, Suga T. Mu F, et al. ACS Appl Mater Interfaces. 2019 Sep 11;11(36):33428-33434. doi: 10.1021/acsami.9b10106. Epub 2019 Aug 28. ACS Appl Mater Interfaces. 2019. PMID: 31408316

5

Thermal characterization of diamond films through modulated photothermal radiometry.

Guillemet T, Kusiak A, Fan L, Heintz JM, Chandra N, Zhou Y, Silvain JF, Lu Y, Battaglia JL. Guillemet T, et al. ACS Appl Mater Interfaces. 2014 Feb 12;6(3):2095-102. doi: 10.1021/am405188r. Epub 2014 Jan 28. ACS Appl Mater Interfaces. 2014. PMID: 24422442

6

Regulated Thermal Boundary Conductance between Copper and Diamond through Nanoscale Interfacial Rough Structures.

Wang Z, Sun F, Liu Z, Zheng L, Wang D, Feng Y. Wang Z, et al. ACS Appl Mater Interfaces. 2023 Mar 29;15(12):16162-16176. doi: 10.1021/acsami.2c21514. Epub 2023 Mar 16. ACS Appl Mater Interfaces. 2023. PMID: 36924078

7

Enhancement of Thermal Boundary Conductance of Metal-Polymer System.

Sandell S, Maire J, Chávez-Ángel E, Torres CMS, Kristiansen H, Zhang Z, He J. Sandell S, et al. Nanomaterials (Basel). 2020 Apr 2;10(4):670. doi: 10.3390/nano10040670. Nanomaterials (Basel). 2020. PMID: 32252435 Free PMC article.

8

Regulated Interfacial Thermal Conductance between Cu and Diamond by a TiC Interlayer for Thermal Management Applications.

Chang G, Sun F, Wang L, Che Z, Wang X, Wang J, Kim MJ, Zhang H. Chang G, et al. ACS Appl Mater Interfaces. 2019 Jul 24;11(29):26507-26517. doi: 10.1021/acsami.9b08106. Epub 2019 Jul 8. ACS Appl Mater Interfaces. 2019. PMID: 31283161

9

Thermal Transport across Metal/β-Ga₂O₃ Interfaces.

Shi J, Yuan C, Huang HL, Johnson J, Chae C, Wang S, Hanus R, Kim S, Cheng Z, Hwang J, Graham S. Shi J, et al. ACS Appl Mater Interfaces. 2021 Jun 23;13(24):29083-29091. doi: 10.1021/acsami.1c05191. Epub 2021 Jun 10. ACS Appl Mater Interfaces. 2021. PMID: 34109790

10

High thermal conductivity in wafer-scale cubic silicon carbide crystals.

Cheng Z, Liang J, Kawamura K, Zhou H, Asamura H, Uratani H, Tiwari J, Graham S, Ohno Y, Nagai Y, Feng T, Shigekawa N, Cahill DG. Cheng Z, et al. Nat Commun. 2022 Nov 23;13(1):7201. doi: 10.1038/s41467-022-34943-w. Nat Commun. 2022. PMID: 36418359 Free PMC article.

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