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Items: 1 to 20 of 110

1.

Electronic waste disassembly with industrial waste heat.

Chen M, Wang J, Chen H, Ogunseitan OA, Zhang M, Zang H, Hu J.

Environ Sci Technol. 2013;47(21):12409-16. doi: 10.1021/es402102t. Epub 2013 Oct 15.

PMID:
24073987
2.

An environmentally friendly technology of disassembling electronic components from waste printed circuit boards.

Wang J, Guo J, Xu Z.

Waste Manag. 2016 Jul;53:218-24. doi: 10.1016/j.wasman.2016.03.036. Epub 2016 Mar 26.

PMID:
27026495
3.

A novel dismantling process of waste printed circuit boards using water-soluble ionic liquid.

Zeng X, Li J, Xie H, Liu L.

Chemosphere. 2013 Oct;93(7):1288-94. doi: 10.1016/j.chemosphere.2013.06.063. Epub 2013 Jul 30.

PMID:
23910241
4.

Exhaust constituent emission factors of printed circuit board pyrolysis processes and its exhaust control.

Chiang HL, Lin KH.

J Hazard Mater. 2014 Jan 15;264:545-51. doi: 10.1016/j.jhazmat.2013.10.049. Epub 2013 Oct 30.

PMID:
24239260
5.

A new technology for separation and recovery of materials from waste printed circuit boards by dissolving bromine epoxy resins using ionic liquid.

Zhu P, Chen Y, Wang LY, Qian GY, Zhou M, Zhou J.

J Hazard Mater. 2012 Nov 15;239-240:270-8. doi: 10.1016/j.jhazmat.2012.08.071. Epub 2012 Sep 4.

PMID:
22985818
6.

Generation of copper rich metallic phases from waste printed circuit boards.

Cayumil R, Khanna R, Ikram-Ul-Haq M, Rajarao R, Hill A, Sahajwalla V.

Waste Manag. 2014 Oct;34(10):1783-92. doi: 10.1016/j.wasman.2014.05.004. Epub 2014 Jul 19.

PMID:
25052340
7.

A new technology for recycling solder from waste printed circuit boards using ionic liquid.

Zhu P, Chen Y, Wang Ly, Zhou M.

Waste Manag Res. 2012 Nov;30(11):1222-6. doi: 10.1177/0734242X12457116. Epub 2012 Sep 5.

PMID:
22951573
8.

Recycling of non-metallic fractions from waste electrical and electronic equipment (WEEE): a review.

Wang R, Xu Z.

Waste Manag. 2014 Aug;34(8):1455-69. doi: 10.1016/j.wasman.2014.03.004. Epub 2014 Apr 13. Review.

PMID:
24726822
9.

Treatment of waste printed circuit board by green solvent using ionic liquid.

Zhu P, Chen Y, Wang LY, Zhou M.

Waste Manag. 2012 Oct;32(10):1914-8. doi: 10.1016/j.wasman.2012.05.025. Epub 2012 Jun 8.

PMID:
22683227
10.

A new technology for recycling materials from waste printed circuit boards.

Zhou Y, Qiu K.

J Hazard Mater. 2010 Mar 15;175(1-3):823-8. doi: 10.1016/j.jhazmat.2009.10.083. Epub 2009 Oct 30.

PMID:
19939558
11.
12.

The separation of waste printed circuit board by dissolving bromine epoxy resin using organic solvent.

Zhu P, Chen Y, Wang LY, Zhou M, Zhou J.

Waste Manag. 2013 Feb;33(2):484-8. doi: 10.1016/j.wasman.2012.10.003. Epub 2012 Nov 21.

PMID:
23177567
13.

Integrated bioleaching of copper metal from waste printed circuit board-a comprehensive review of approaches and challenges.

Awasthi AK, Zeng X, Li J.

Environ Sci Pollut Res Int. 2016 Nov;23(21):21141-21156. Epub 2016 Sep 28. Review.

PMID:
27678000
14.

Interfacial and mechanical property analysis of waste printed circuit boards subject to thermal shock.

Li J, Duan H, Yu K, Wang S.

J Air Waste Manag Assoc. 2010 Feb;60(2):229-36.

PMID:
20222536
15.

Metals recovering from waste printed circuit boards (WPCBs) using molten salts.

Flandinet L, Tedjar F, Ghetta V, Fouletier J.

J Hazard Mater. 2012 Apr 30;213-214:485-90. doi: 10.1016/j.jhazmat.2012.02.037. Epub 2012 Feb 21.

PMID:
22398030
16.

An advanced study on the hydrometallurgical processing of waste computer printed circuit boards to extract their valuable content of metals.

Birloaga I, Coman V, Kopacek B, VegliĆ² F.

Waste Manag. 2014 Dec;34(12):2581-6. doi: 10.1016/j.wasman.2014.08.028. Epub 2014 Sep 18.

PMID:
25242605
17.

Printed circuit boards: a review on the perspective of sustainability.

Canal Marques A, Cabrera JM, Malfatti Cde F.

J Environ Manage. 2013 Dec 15;131:298-306. doi: 10.1016/j.jenvman.2013.10.003. Epub 2013 Nov 2. Review.

PMID:
24189538
18.

An innovative approach to predict technology evolution for the desoldering of printed circuit boards: A perspective from China and America.

Wang C, Zhao W, Wang J, Chen L, Luo CJ.

Waste Manag Res. 2016 Jun;34(6):491-501. doi: 10.1177/0734242X16640330. Epub 2016 Apr 11.

PMID:
27067430
19.

A novel approach to recycling of glass fibers from nonmetal materials of waste printed circuit boards.

Zheng Y, Shen Z, Ma S, Cai C, Zhao X, Xing Y.

J Hazard Mater. 2009 Oct 30;170(2-3):978-82. doi: 10.1016/j.jhazmat.2009.05.065. Epub 2009 May 21.

PMID:
19520504
20.

Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging.

Palmieri R, Bonifazi G, Serranti S.

Waste Manag. 2014 Nov;34(11):2120-30. doi: 10.1016/j.wasman.2014.06.003. Epub 2014 Jul 3.

PMID:
24997795

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