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Items: 1 to 20 of 128

1.

High frequency characteristics of printed Cu conductive circuit.

Kim JW, Lee YC, Kim KS, Jung SB.

J Nanosci Nanotechnol. 2011 Jan;11(1):537-40.

PMID:
21446492
2.

Effect of sintering temperature on electrical characteristics of screen-printed Ag nanopaste on FR4 substrate.

Lee YC, Ahn JH, Kim KS, Yoon JW, Kim JW, Kim Y, Jung SB.

J Nanosci Nanotechnol. 2011 Jul;11(7):5915-20.

PMID:
22121631
3.

Electrical characteristics of printed Ag nanopaste on polyimide substrate.

Lee YC, Kim KS, Kim JW, Kim JM, Nah W, Lee SH, Jung SB.

J Nanosci Nanotechnol. 2011 Feb;11(2):1468-71.

PMID:
21456214
4.

Flexibility of silver conductive circuits screen-printed on a polyimide substrate.

Kim KS, Lee YC, Kim JW, Jung SB.

J Nanosci Nanotechnol. 2011 Feb;11(2):1493-8.

PMID:
21456220
5.

Electrochemical migration characteristics of screen-printed silver patterns on FR-4 substrate.

Kim KS, Ahn JH, Noh BI, Jung SB.

J Nanosci Nanotechnol. 2012 Apr;12(4):3219-23.

PMID:
22849092
6.

Evaluation of the flexibility of silver circuits screen-printed on polyimide with an environmental reliability test.

Kim KS, Lee YC, Ahn JH, Jung SB.

J Nanosci Nanotechnol. 2011 Jul;11(7):5806-11.

PMID:
22121611
7.

Microwave Sintering of Silver Nanoink for Radio Frequency Applications.

Kim KS, Park BG, Jung KH, Kim JW, Jeong MY, Jung SB.

J Nanosci Nanotechnol. 2015 Mar;15(3):2333-7.

PMID:
26413662
8.

Electrical and electrochemical migration characteristics of Ag/Cu nanopaste patterns.

Koh M, Kim KS, Park BG, Jung KH, Lee CS, Choa YH, Jeong MY, Jung SB.

J Nanosci Nanotechnol. 2014 Dec;14(12):8915-9.

PMID:
25970981
9.

A low sintering temperature and electrical performance of nanoparticle copper ink for use in ink-jet printing.

Cho MS, Choi WH, Kim SG, Kim IH, Lee Y.

J Nanosci Nanotechnol. 2010 Oct;10(10):6888-91.

PMID:
21137818
10.

Screen-printed Cu circuit for low-Cost fabrication and its electrochemical migration characteristics.

Jung KH, Kim KS, Park BG, Jung SB.

J Nanosci Nanotechnol. 2014 Dec;14(12):9493-7.

PMID:
25971089
11.

Highly Conductive Cu-Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles.

Liu J, Chen H, Ji H, Li M.

ACS Appl Mater Interfaces. 2016 Dec 7;8(48):33289-33298.

PMID:
27934145
12.

Effect of lead-free frit on conductivity of nanoparticles-aided silver paste.

Park SH, Seo DS, Lee JK.

J Nanosci Nanotechnol. 2008 Oct;8(10):5331-6.

PMID:
19198449
13.

In situ monitoring of flash-light sintering of copper nanoparticle ink for printed electronics.

Hwang HJ, Chung WH, Kim HS.

Nanotechnology. 2012 Dec 7;23(48):485205. doi: 10.1088/0957-4484/23/48/485205.

PMID:
23138346
14.

Preparation of conductive silver paste using bimodal particles.

Han HG, Seo DS, Lee JK.

J Nanosci Nanotechnol. 2008 Oct;8(10):5576-80.

PMID:
19198502
15.

Highly conductive copper nano/microparticles ink via flash light sintering for printed electronics.

Joo SJ, Hwang HJ, Kim HS.

Nanotechnology. 2014 Jul 4;25(26):265601. doi: 10.1088/0957-4484/25/26/265601.

PMID:
24916116
16.

Graphene-Ag nanohexagonal platelets-based ink with high electrical properties at low sintering temperatures.

Liu P, Ma J, Deng S, Zeng K, Deng D, Xie W, Lu A.

Nanotechnology. 2016 Sep 23;27(38):385603. doi: 10.1088/0957-4484/27/38/385603.

PMID:
27518607
17.

Microstructure and adhesion characteristics of a silver nanopaste screen-printed on Si substrate.

Kim KS, Kim Y, Jung SB.

Nanoscale Res Lett. 2012 Jan 5;7(1):49. doi: 10.1186/1556-276X-7-49.

18.

The influence of sintering temperature on the proliferation of fibroblastic cells in contact with HA-bioceramics.

Frayssinet P, Rouquet N, Fages J, Durand M, Vidalain PO, Bonel G.

J Biomed Mater Res. 1997 Jun 5;35(3):337-47.

PMID:
9138068
19.

Conductive inks with a "built-in" mechanism that enables sintering at room temperature.

Grouchko M, Kamyshny A, Mihailescu CF, Anghel DF, Magdassi S.

ACS Nano. 2011 Apr 26;5(4):3354-9. doi: 10.1021/nn2005848.

PMID:
21438563
20.

Printed silver nanowire antennas with low signal loss at high-frequency radio.

Komoda N, Nogi M, Suganuma K, Kohno K, Akiyama Y, Otsuka K.

Nanoscale. 2012 May 21;4(10):3148-53. doi: 10.1039/c2nr30485f.

PMID:
22522460
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