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Items: 6

1.

Deterministic Nanoassembly of Quasi-Three-Dimensional Plasmonic Nanoarrays with Arbitrary Substrate Materials and Structures.

Kim B, Jeon J, Zhang Y, Wie DS, Hwang J, Lee SJ, Walker DE Jr, Abeysinghe DC, Urbas A, Xu B, Ku Z, Lee CH.

Nano Lett. 2019 Aug 14;19(8):5796-5805. doi: 10.1021/acs.nanolett.9b02598. Epub 2019 Aug 5.

PMID:
31348661
2.

Flexible elastomer patch with vertical silicon nanoneedles for intracellular and intratissue nanoinjection of biomolecules.

Kim H, Jang H, Kim B, Kim MK, Wie DS, Lee HS, Kim DR, Lee CH.

Sci Adv. 2018 Nov 9;4(11):eaau6972. doi: 10.1126/sciadv.aau6972. eCollection 2018 Nov.

3.

Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics.

Wie DS, Zhang Y, Kim MK, Kim B, Park S, Kim YJ, Irazoqui PP, Zheng X, Xu B, Lee CH.

Proc Natl Acad Sci U S A. 2018 Jul 31;115(31):E7236-E7244. doi: 10.1073/pnas.1806640115. Epub 2018 Jul 16.

4.

Mechanically Reinforced Skin-Electronics with Networked Nanocomposite Elastomer.

Han S, Kim MK, Wang B, Wie DS, Wang S, Lee CH.

Adv Mater. 2016 Dec;28(46):10257-10265. doi: 10.1002/adma.201603878. Epub 2016 Oct 7.

PMID:
27714861
5.

Bioresorbable silicon electronic sensors for the brain.

Kang SK, Murphy RK, Hwang SW, Lee SM, Harburg DV, Krueger NA, Shin J, Gamble P, Cheng H, Yu S, Liu Z, McCall JG, Stephen M, Ying H, Kim J, Park G, Webb RC, Lee CH, Chung S, Wie DS, Gujar AD, Vemulapalli B, Kim AH, Lee KM, Cheng J, Huang Y, Lee SH, Braun PV, Ray WZ, Rogers JA.

Nature. 2016 Feb 4;530(7588):71-6. doi: 10.1038/nature16492. Epub 2016 Jan 18.

PMID:
26779949
6.

Thermally triggered degradation of transient electronic devices.

Park CW, Kang SK, Hernandez HL, Kaitz JA, Wie DS, Shin J, Lee OP, Sottos NR, Moore JS, Rogers JA, White SR.

Adv Mater. 2015 Jul 1;27(25):3783-8. doi: 10.1002/adma.201501180. Epub 2015 May 20.

PMID:
25991389

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