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Sensors (Basel). 2015 Dec 16;15(12):31821-32. doi: 10.3390/s151229885.

Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems.

Author information

1
Department of Electrical and Electronic Information Engineering, Toyohashi University of Technology, Aichi 441-8580, Japan. okabe-k@int.ee.tut.ac.jp.
2
Department of Electrical and Electronic Information Engineering, Toyohashi University of Technology, Aichi 441-8580, Japan. jeewan@int.ee.tut.ac.jp.
3
Department of Electrical and Electronic Information Engineering, Toyohashi University of Technology, Aichi 441-8580, Japan. yamagiwa-s@int.ee.tut.ac.jp.
4
Department of Electrical and Electronic Information Engineering, Toyohashi University of Technology, Aichi 441-8580, Japan. kawano@ee.tut.ac.jp.
5
Department of Electrical and Electronic Information Engineering, Toyohashi University of Technology, Aichi 441-8580, Japan. ishida@ee.tut.ac.jp.
6
Electronics-Inspired Interdisciplinary Research Institute (EIIRIS), Toyohashi University of Technology, Aichi 441-8580, Japan. ishida@ee.tut.ac.jp.
7
Department of Electrical and Electronic Information Engineering, Toyohashi University of Technology, Aichi 441-8580, Japan. ippei.akita@ieee.org.

Abstract

In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system architecture, and can help avoid the use of external matching components, resulting in the realization of a small-size system. In addition, the technique employed to assemble a silicon large-scale integration (LSI) chip on the very thin parylene film (5 μm) enables the integration of the rectifier circuits and the flexible antenna (rectenna). In the demonstration of wireless power transmission (WPT), the fabricated flexible rectenna achieved a maximum efficiency of 0.497% with a distance of 3 cm between antennas. In addition, WPT with radio waves allows a misalignment of 185% against antenna size, implying that the misalignment has a less effect on the WPT characteristics compared with electromagnetic induction.

KEYWORDS:

flexible substrate; flip-chip bonding; rectenna; wafer-level packaging; wireless power transmission

PMID:
26694407
PMCID:
PMC4721804
DOI:
10.3390/s151229885
[Indexed for MEDLINE]
Free PMC Article

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