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Development of an integrated microelectrode/microelectronic device for brain implantable neuroengineering applications.

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1
Division of Engineering, Brown University, Providence, RI, USA.

Abstract

An ultra-low power analog CMOS chip and a silicon based microelectrode array have been fully integrated to a microminiaturized "neuroport" for brain implantable neuroengineering applications. The CMOS IC included preamplifier and multiplexing circuitry, and a hybrid flip-chip bonding technique was developed to fabricate a functional , encapsulated microminiaturized neuroprobe device. As a proof-of-concept demonstration, we have measured local field potentials from thalamocortical brain slices of rats, suggesting that the new neuroport can form a prime platform for the development of a microminiaturized neural interface to the brain in a single implantable unit.

PMID:
17271189
DOI:
10.1109/IEMBS.2004.1404131

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