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Micromachines (Basel). 2019 Apr 16;10(4). pii: E250. doi: 10.3390/mi10040250.

Machining of Lenticular Lens Silicon Molds with a Combination of Laser Ablation and Diamond Cutting.

Author information

1
The State Key Laboratory of Ultraprecision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Kowloon, Hong Kong, China. jide.han@connect.polyu.hk.
2
The State Key Laboratory of Ultraprecision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Kowloon, Hong Kong, China. lihua.li@polyu.edu.hk.
3
The State Key Laboratory of Ultraprecision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Kowloon, Hong Kong, China. wb.lee@polyu.edu.hk.

Abstract

Lenticular lenses are widely used in the three-dimensional display industry. Conventional lenticular lens components are made of plastics that have low thermal stability. An alternative is to use glass to replace plastic as the lenticular lens component material. Single crystal silicon is often used as the mold material in the precision glass molding process. It is, however, difficult to fabricate a lenticular lens silicon mold that has a large feature size compared to the critical depth of cut of silicon. In order to solve the problems of machining lenticular lens silicon molds using the conventional diamond cutting method, such as low machining efficiency and severe tool wear, a hybrid machining method that combined laser ablation and diamond cutting was proposed. A feasibility study was performed to investigate the possibility of using this method to fabricate a lenticular lens silicon mold. The influence of the laser parameters and machining parameters on the machining performance was investigated systematically. The experimental results indicated that this hybrid machining method could be a possible method for manufacturing lenticular lens silicon molds or other similar microstructures.

KEYWORDS:

diamond cutting; hybrid machining; laser ablation; lenticular lens; single crystal silicon

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