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Items: 10

1.

Investigation on Low Firing Copper for Front Electrode of Si-Based Solar Cell Applications.

Chiang CS, Wu YM, Lee WH.

J Nanosci Nanotechnol. 2018 Apr 1;18(4):2716-2722. doi: 10.1166/jnn.2018.14353.

PMID:
29442948
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Effects of photo-assisted electrodeposited on CuInSe2 thin films.

Chang TW, Lee WH, Su YH, Hsiao YJ.

Nanoscale Res Lett. 2014 Dec 9;9(1):660. doi: 10.1186/1556-276X-9-660. eCollection 2014.

5.

Investigation the electroplating behavior of self formed CuMn barrier.

Wu CY, Lee WH, Chang SC, Wang YL.

J Nanosci Nanotechnol. 2013 Aug;13(8):5800-6.

PMID:
23882838
6.

A novel synthesis of a CuInSe2 thin film from electrodeposited Cu-Se-In-Se precursors with three steps annealing.

Hu SY, Lee WH, Chang SC, Wang YL.

J Nanosci Nanotechnol. 2012 Sep;12(9):7226-32.

PMID:
23035457
7.

A Study of Trimethylsilane (3MS) and Tetramethylsilane (4MS) Based α-SiCN:H/α-SiCO:H Diffusion Barrier Films.

Chen SW, Wang YS, Hu SY, Lee WH, Chi CC, Wang YL.

Materials (Basel). 2012 Mar 2;5(3):377-384. doi: 10.3390/ma5030377.

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Effect of under-layer treatment of Ta/TaN barrier film on corrosion between Cu seed and Ta in chemical-mechanical-polishing slurry.

Lee WH, Hung CC, Wang YS, Chang SC, Wang YL.

J Nanosci Nanotechnol. 2010 Jul;10(7):4196-203.

PMID:
21128400
10.

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