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Items: 2

1.

Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications.

Zain-Ul-Abdein M, Ijaz H, Saleem W, Raza K, Mahfouz ASB, Mabrouki T.

Materials (Basel). 2017 Jul 2;10(7). pii: E739. doi: 10.3390/ma10070739.

2.

Antibody functionalized graphene biosensor for label-free electrochemical immunosensing of fibrinogen, an indicator of trauma induced coagulopathy.

Saleem W, Salinas C, Watkins B, Garvey G, Sharma AC, Ghosh R.

Biosens Bioelectron. 2016 Dec 15;86:522-529. doi: 10.1016/j.bios.2016.07.009. Epub 2016 Jul 5.

PMID:
27448541

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