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Items: 2

1.

Solid-Liquid Interdiffusion (SLID) Bonding of p-Type Skutterudite Thermoelectric Material Using Al-Ni Interlayers.

Placha K, Tuley RS, Salvo M, Casalegno V, Simpson K.

Materials (Basel). 2018 Dec 6;11(12). pii: E2483. doi: 10.3390/ma11122483.

2.

Brazing of Mo to Glidcop Dispersion Strengthened Copper for Accelerating Structures.

Casalegno V, Perero S, Ferraris M, Taborelli M, Arnau Izquierdo G, Sgobba S, Salvo M.

Materials (Basel). 2018 Sep 7;11(9). pii: E1658. doi: 10.3390/ma11091658.

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