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Items: 1 to 20 of 38

1.

Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining.

Kim D, Yamamoto Y, Nagao S, Wakasugi N, Chen C, Suganuma K.

Micromachines (Basel). 2019 Oct 31;10(11). pii: E745. doi: 10.3390/mi10110745.

2.

Alloying and Embedding of Cu-Core/Ag-Shell Nanowires for Ultrastable Stretchable and Transparent Electrodes.

Zhang B, Li W, Nogi M, Chen C, Yang Y, Sugahara T, Koga H, Suganuma K.

ACS Appl Mater Interfaces. 2019 May 22;11(20):18540-18547. doi: 10.1021/acsami.9b04169. Epub 2019 May 14.

PMID:
31055926
3.

Large-Scale and Galvanic Replacement Free Synthesis of Cu@Ag Core-Shell Nanowires for Flexible Electronics.

Zhang B, Li W, Jiu J, Yang Y, Jing J, Suganuma K, Li CF.

Inorg Chem. 2019 Mar 4;58(5):3374-3381. doi: 10.1021/acs.inorgchem.8b03460. Epub 2019 Feb 21.

PMID:
30789711
4.

Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics.

Li CF, Li W, Zhang H, Jiu J, Yang Y, Li L, Gao Y, Liu ZQ, Suganuma K.

ACS Appl Mater Interfaces. 2019 Jan 23;11(3):3231-3240. doi: 10.1021/acsami.8b19069. Epub 2019 Jan 9.

PMID:
30588790
5.

Three-Dimensional Stretchable and Transparent Conductors with Controllable Strain-Distribution Based on Template-Assisted Transfer Printing.

Li W, Yang Y, Zhang B, Li L, Liu G, Li CF, Jiu J, Suganuma K.

ACS Appl Mater Interfaces. 2019 Jan 16;11(2):2140-2148. doi: 10.1021/acsami.8b18670. Epub 2019 Jan 3.

PMID:
30569697
6.

Heat-Resistant Microporous Ag Die-Attach Structure for Wide Band-Gap Power Semiconductors.

Noh S, Zhang H, Suganuma K.

Materials (Basel). 2018 Dec 12;11(12). pii: E2531. doi: 10.3390/ma11122531.

7.

Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni⁻P Layers for High-Temperature Applications of Power Device Modules.

Choe C, Chen C, Noh S, Suganuma K.

Materials (Basel). 2018 Nov 28;11(12). pii: E2394. doi: 10.3390/ma11122394.

8.

The Surface Coating of Commercial LiFePO4 by Utilizing ZIF-8 for High Electrochemical Performance Lithium Ion Battery.

Xu X, Qi C, Hao Z, Wang H, Jiu J, Liu J, Yan H, Suganuma K.

Nanomicro Lett. 2018;10(1):1. doi: 10.1007/s40820-017-0154-4. Epub 2017 Sep 25.

9.

Highly Stable Transparent Conductive Electrodes Based on Silver-Platinum Alloy-Walled Hollow Nanowires for Optoelectronic Devices.

Zhou KL, Han CB, Li CF, Jiu J, Yang Y, Li L, Wang H, Liu JB, Liu ZQ, Yan H, Suganuma K.

ACS Appl Mater Interfaces. 2018 Oct 24;10(42):36128-36135. doi: 10.1021/acsami.8b12238. Epub 2018 Oct 9.

PMID:
30256082
10.

The comprehensive effects of visible light irradiation on silver nanowire transparent electrode.

Wang J, Jiu J, Zhang S, Sugahara T, Nagao S, Suganuma K, He P.

Nanotechnology. 2018 Oct 26;29(43):435701. doi: 10.1088/1361-6528/aad619. Epub 2018 Jul 26.

PMID:
30047924
11.

Thin Film of Amorphous Zinc Hydroxide Semiconductor for Optical Devices with an Energy-Efficient Beneficial Coating by Metal Organic Decomposition Process.

Karakawa M, Sugahara T, Hirose Y, Suganuma K, Aso Y.

Sci Rep. 2018 Jul 20;8(1):10839. doi: 10.1038/s41598-018-27953-6.

12.

Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 °C.

Li W, Li CF, Lang F, Jiu J, Ueshima M, Wang H, Liu ZQ, Suganuma K.

Nanoscale. 2018 Mar 15;10(11):5254-5263. doi: 10.1039/c7nr09225c.

PMID:
29498383
13.

Bottom-Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via.

Sun FL, Liu ZQ, Li CF, Zhu QS, Zhang H, Suganuma K.

Materials (Basel). 2018 Feb 23;11(2). pii: E319. doi: 10.3390/ma11020319.

14.

Printable and Flexible Copper-Silver Alloy Electrodes with High Conductivity and Ultrahigh Oxidation Resistance.

Li W, Hu D, Li L, Li CF, Jiu J, Chen C, Ishina T, Sugahara T, Suganuma K.

ACS Appl Mater Interfaces. 2017 Jul 26;9(29):24711-24721. doi: 10.1021/acsami.7b05308. Epub 2017 Jul 17.

PMID:
28675295
15.

Hazy Transparent Cellulose Nanopaper.

Hsieh MC, Koga H, Suganuma K, Nogi M.

Sci Rep. 2017 Jan 27;7:41590. doi: 10.1038/srep41590.

16.

Biaxially stretchable silver nanowire conductive film embedded in a taro leaf-templated PDMS surface.

Wu C, Jiu J, Araki T, Koga H, Sekitani T, Wang H, Suganuma K.

Nanotechnology. 2017 Jan 6;28(1):01LT01. Epub 2016 Nov 28.

PMID:
27893449
17.

Stretchable and transparent electrodes based on patterned silver nanowires by laser-induced forward transfer for non-contacted printing techniques.

Araki T, Mandamparambil R, van Bragt DM, Jiu J, Koga H, van den Brand J, Sekitani T, den Toonder JM, Suganuma K.

Nanotechnology. 2016 Nov 11;27(45):45LT02. Epub 2016 Oct 7.

PMID:
27713190
18.

Nano-volcanic Eruption of Silver.

Lin SK, Nagao S, Yokoi E, Oh C, Zhang H, Liu YC, Lin SG, Suganuma K.

Sci Rep. 2016 Oct 5;6:34769. doi: 10.1038/srep34769.

19.

One-Step Fabrication of Stretchable Copper Nanowire Conductors by a Fast Photonic Sintering Technique and Its Application in Wearable Devices.

Ding S, Jiu J, Gao Y, Tian Y, Araki T, Sugahara T, Nagao S, Nogi M, Koga H, Suganuma K, Uchida H.

ACS Appl Mater Interfaces. 2016 Mar 9;8(9):6190-9. doi: 10.1021/acsami.5b10802. Epub 2016 Feb 23.

PMID:
26830466
20.

Fast fabrication of copper nanowire transparent electrodes by a high intensity pulsed light sintering technique in air.

Ding S, Jiu J, Tian Y, Sugahara T, Nagao S, Suganuma K.

Phys Chem Chem Phys. 2015 Dec 14;17(46):31110-6. doi: 10.1039/c5cp04582g.

PMID:
26536570

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