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Biomed Mater Eng. 2015;26(1-2):39-47. doi: 10.3233/BME-151547.

Mechanical behavior and blood compatibility of copper-containing films as potential biomaterials.

Author information

1
College of Materials and Chemistry & Chemical Engineering, Chengdu University of Technology, Chengdu, China.
2
Department of Research & Development, Lifetech Scientific (Shenzhen) Co., Ltd, Shenzhen, China.
3
Department of Research & Development, Kinhely Bio-Tech Co., Ltd, Shenzhen, China.

Abstract

Surface modification is one approach to enhance the biocompatibility of implanted cardiovascular devices. In this work, a copper-containing film used to blood contacted biomaterials was prepared by vacuum arc deposition. The phase composition of the films was investigated via X-ray diffraction, and the adherence strength of the films was evaluated with conventional deformation tests. Blood compatibility of the films was characterized by hemolysis ratio, clotting time and platelet adhesion etc. The surface of inferior vena cava filters were smooth and uniform, no cracks or delaminations were observed on the deformed surface. These results indicate that the mechanical behavior of the films is suitable for withstanding deformation stresses as operation in clinic. Good blood compatibility of the copper-containing films was identified through experiment in vitro, the activated partial thromboplastin times (APTTs) of Cu/Ti films were similar to that of the uncoated substrate, and Cu/Ti films were also found to inhibit platelet adhesion comparing to the nitinol substrate. However, with increasing ratio of Cu/Ti, the hemolysis ratio increased, resulting in platelet damage. These results indicate that the copper-containing film has potential application on blood contacted devices.

KEYWORDS:

Copper-containing film; blood compatibility; mechanical behavior

PMID:
26484554
DOI:
10.3233/BME-151547
[Indexed for MEDLINE]

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