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Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining.

Kim D, Yamamoto Y, Nagao S, Wakasugi N, Chen C, Suganuma K.

Micromachines (Basel). 2019 Oct 31;10(11). pii: E745. doi: 10.3390/mi10110745.


Alloying and Embedding of Cu-Core/Ag-Shell Nanowires for Ultrastable Stretchable and Transparent Electrodes.

Zhang B, Li W, Nogi M, Chen C, Yang Y, Sugahara T, Koga H, Suganuma K.

ACS Appl Mater Interfaces. 2019 May 22;11(20):18540-18547. doi: 10.1021/acsami.9b04169. Epub 2019 May 14.


Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni⁻P Layers for High-Temperature Applications of Power Device Modules.

Choe C, Chen C, Noh S, Suganuma K.

Materials (Basel). 2018 Nov 28;11(12). pii: E2394. doi: 10.3390/ma11122394.


Printable and Flexible Copper-Silver Alloy Electrodes with High Conductivity and Ultrahigh Oxidation Resistance.

Li W, Hu D, Li L, Li CF, Jiu J, Chen C, Ishina T, Sugahara T, Suganuma K.

ACS Appl Mater Interfaces. 2017 Jul 26;9(29):24711-24721. doi: 10.1021/acsami.7b05308. Epub 2017 Jul 17.


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