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Items: 3

1.

Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes.

Huang YC, Huang PT, Wu SL, Hu YC, You YH, Chen JM, Huang YY, Chang HC, Lin YH, Duann JR, Chiu TW, Hwang W, Chen KN, Chuang CT, Chiou JC.

IEEE Trans Biomed Circuits Syst. 2017 Oct;11(5):1013-1025. doi: 10.1109/TBCAS.2017.2669439. Epub 2017 Mar 30.

PMID:
28371785
2.

A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications.

Chang CW, Chou LC, Huang PT, Wu SL, Lee SW, Chuang CT, Chen KN, Hwang W, Chen KH, Chiu CT, Tong HM, Chiou JC.

Biomed Microdevices. 2015 Feb;17(1):11. doi: 10.1007/s10544-014-9906-9.

PMID:
25653056
3.

2.5D heterogeneously integrated microsystem for high-density neural sensing applications.

Huang PT, Wu SL, Huang YC, Chou LC, Huang TC, Wang TH, Lin YR, Cheng CA, Shen WW, Chuang CT, Chen KN, Chiou JC, Hwang W, Tong HM.

IEEE Trans Biomed Circuits Syst. 2014 Dec;8(6):810-23. doi: 10.1109/TBCAS.2014.2385061. Epub 2015 Jan 5.

PMID:
25576575

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