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Sensors (Basel). 2017 May 23;17(6). pii: E1191. doi: 10.3390/s17061191.

Thermal Characterization of Dynamic Silicon Cantilever Array Sensors by Digital Holographic Microscopy.

Author information

1
Max Planck Institute for Polymer Research, Ackermannweg 10, 55128 Mainz, Germany. zakerin@mpip-mainz.mpg.de.
2
Laboratoire d'Acoustique de l'Université du Maine (LAUM, UMR CNRS 6613), 72000 Le Mans, France. antonin.novak@univ-lemans.fr.
3
Graduate School of Engineering, Tohoku University, 6-6-01 Aramaki-Aza-Aoba, Aoba-ku, 980-8579 Sendai, Japan. mtoda@nme.mech.tohoku.ac.jp.
4
Lyncee Tec SA, PSE-A, CH-1015 Lausanne, Switzerland. yves.emery@lynceetec.com.
5
Institut für Chemie, Martin-Luther-Universität Halle-Wittenberg, Kurt-Mothes-Straße 2, 06120 Halle (Saale), Germany. filipe.natalio@chemie.uni-halle.de.
6
Max Planck Institute for Polymer Research, Ackermannweg 10, 55128 Mainz, Germany. Butt@mpip-mainz.mpg.de.
7
Max Planck Institute for Polymer Research, Ackermannweg 10, 55128 Mainz, Germany. berger@mpip-mainz.mpg.de.

Abstract

In this paper, we apply a digital holographic microscope (DHM) in conjunction with stroboscopic acquisition synchronization. Here, the temperature-dependent decrease of the first resonance frequency (S₁(T)) and Young's elastic modulus (E₁(T)) of silicon micromechanical cantilever sensors (MCSs) are measured. To perform these measurements, the MCSs are uniformly heated from T₀ = 298 K to T = 450 K while being externally actuated with a piezo-actuator in a certain frequency range close to their first resonance frequencies. At each temperature, the DHM records the time-sequence of the 3D topographies for the given frequency range. Such holographic data allow for the extracting of the out-of-plane vibrations at any relevant area of the MCSs. Next, the Bode and Nyquist diagrams are used to determine the resonant frequencies with a precision of 0.1 Hz. Our results show that the decrease of resonance frequency is a direct consequence of the reduction of the silicon elastic modulus upon heating. The measured temperature dependence of the Young's modulus is in very good accordance with the previously-reported values, validating the reliability and applicability of this method for micromechanical sensing applications.

KEYWORDS:

digital holography; micromechanical cantilever sensors; temperature coefficient of elastic modulus; temperature coefficient of resonance frequency; thermal load

Conflict of interest statement

The authors declare no conflict of interest. In addition, the founding sponsors had no role in the design of the study; in the collection, analyses, or interpretation of data; in the writing of the manuscript, and in the decision to publish the results. Yves Emery is co-founder and CEO of the company manufacturing the R-DHM used in the frame of this study.

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