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Items: 4

1.

Hybrid Printing for the Fabrication of Smart Sensors.

Faller LM, Zikulnig J, Krivec M, Roshanghias A, Abram A, Zangl H.

J Vis Exp. 2019 Jan 31;(143). doi: 10.3791/58677.

PMID:
30774128
2.

Enthalpy Effect of Adding Cobalt to Liquid Sn-3.8Ag-0.7Cu Lead-Free Solder Alloy: Difference between Bulk and Nanosized Cobalt.

Yakymovych A, Kaptay G, Roshanghias A, Flandorfer H, Ipser H.

J Phys Chem C Nanomater Interfaces. 2016 Jan 28;120(3):1881-1890. Epub 2016 Jan 20.

3.

Sn-Ag-Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system.

Roshanghias A, Vrestal J, Yakymovych A, Richter KW, Ipser H.

CALPHAD. 2015 Jun;49:101-109.

4.

Synthesis and thermal behavior of tin-based alloy (Sn-Ag-Cu) nanoparticles.

Roshanghias A, Yakymovych A, Bernardi J, Ipser H.

Nanoscale. 2015 Mar 19;7(13):5843-51. doi: 10.1039/c5nr00462d.

PMID:
25757694

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