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Polymers (Basel). 2018 Dec 14;10(12). pii: E1390. doi: 10.3390/polym10121390.

Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser.

Author information

1
School of Materials Engineering, Shanghai University of Engineering Science, Shanghai 201620, China. 05170004@sues.edu.cn.
2
Shanghai Collaborative Innovation Center of Laser Advanced Manufacturing Technology, Shanghai 201620, China. 05170004@sues.edu.cn.
3
School of Materials Engineering, Shanghai University of Engineering Science, Shanghai 201620, China. 18321261951wang@gmail.com.

Abstract

High density and high quality interconnects are necessary for the preparation of miniaturized and lightweight electronic products. Therefore, small-diameter and high-density through-holes in FPCs (Flexible Printed Circuits) are required. However, the current processing methods cannot further decrease the diameters and improve the quality of through-holes. Comparatively, ultrashort pulse laser is a good choice. In this paper, the processing technology for the microdrilling of through-holes in FPCs using a 10 ps pulse laser was systematically studied. The effects of laser parameters, including the wavelength, energy, pulses and polarization, on the drilling of through-holes were investigated. The various processing parameters were optimized and the plausible reasons were discussed. Finally, the desired small-diameter and high-density through-holes in FPCs were obtained. The experimental results showed that, through-holes with diameters of less than 10 µm and inlet interconnection pitches of 0~2 µm could be successfully drilled in FPCs using ultrashort pulse laser.

KEYWORDS:

FPCs; high-density; microdrilling; picosecond ultrashort pulse laser; through-holes

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