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Items: 3

1.

Comprehensive Die Shear Test of Silicon Packages Bonded by Thermocompression of Al Layers with Thin Sn Capping or Insertions.

Satoh S, Fukushi H, Esashi M, Tanaka S.

Micromachines (Basel). 2018 Apr 11;9(4). pii: E174. doi: 10.3390/mi9040174.

2.

A Novel Method and an Equipment for Generating the Standard Moisture in Gas Flowing through a Pipe.

Tsukahara Y, Hirayama O, Takeda N, Oizumi T, Fukushi H, Sato N, Tsuji T, Yamanaka K, Akao S.

Sensors (Basel). 2018 Oct 13;18(10). pii: E3438. doi: 10.3390/s18103438.

3.

Development of ball surface acoustic wave trace moisture analyzer using burst waveform undersampling circuit.

Tsuji T, Oizumi T, Fukushi H, Takeda N, Akao S, Tsukahara Y, Yamanaka K.

Rev Sci Instrum. 2018 May;89(5):055006. doi: 10.1063/1.4993928.

PMID:
29864824

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