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Adv Mater. 2019 May 7:e1901400. doi: 10.1002/adma.201901400. [Epub ahead of print]

Universal Route to Impart Orthogonality to Polymer Semiconductors for Sub-Micrometer Tandem Electronics.

Author information

1
Department of Chemical Engineering, Hanyang University, Seoul, 04763, Republic of Korea.
2
School of Electronic Engineering, Soongsil University, Seoul, 06978, Republic of Korea.
3
Department of Chemical Engineering, Soongsil University, Seoul, 06978, Republic of Korea.
4
Department of Chemical and Biomolecular Engineering, Sogang University, Seoul, 04107, Republic of Korea.
5
Department of Chemical Engineering, Pohang University of Science and Technology, Pohang, 37673, Republic of Korea.
6
Department of Chemistry, Ulsan National Institute of Science and Technology (UNIST), Ulsan, 44919, Republic of Korea.
7
Division of Physics and Semiconductor Science, Dongguk University, Seoul, 04620, Republic of Korea.
8
Department of Materials Engineering and Convergence Technology, Gyeongsang National University, Jinju, 52828, Republic of Korea.
9
Department of Chemistry, Gyeongsang National University, Jinju, 52828, Republic of Korea.

Abstract

A universal method that enables utilization of conventional photolithography for processing a variety of polymer semiconductors is developed. The method relies on imparting chemical and physical orthogonality to a polymer film via formation of a semi-interpenetrating diphasic polymer network with a bridged polysilsesquioxane structure, which is termed an orthogonal polymer semiconductor gel. The synthesized gel films remain tolerant to various chemical and physical etching processes involved in photolithography, thereby facilitating fabrication of high-resolution patterns of polymer semiconductors. This method is utilized for fabricating tandem electronics, including pn-complementary inverter logic devices and pixelated polymer light-emitting diodes, which require deposition of multiple polymer semiconductors through solution processes. This novel and universal method is expected to significantly influence the development of advanced polymer electronics requiring sub-micrometer tandem structures.

KEYWORDS:

orthogonal polymer semiconductor gel; photolithography; semi-interpenetrating diphasic polymer network; sequential solution processes; sub-micrometer tandem electronics

PMID:
31063271
DOI:
10.1002/adma.201901400

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