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Sci Rep. 2019 Feb 15;9(1):2166. doi: 10.1038/s41598-019-38477-y.

Applicability of Aerosol Deposition Process for flexible electronic device and determining the Film Formation Mechanism with Cushioning Effects.

Author information

1
Department of Electronic Materials Engineering, Kwangwoon University, 20 Kwangwoon-ro, Seoul, 01897, Republic of Korea.
2
Department of Electronic Materials Engineering, Kwangwoon University, 20 Kwangwoon-ro, Seoul, 01897, Republic of Korea. jmOH@kw.ac.kr.
3
Department of Electronic Materials Engineering, Kwangwoon University, 20 Kwangwoon-ro, Seoul, 01897, Republic of Korea. leeds@kw.ac.kr.

Abstract

In this paper, we demonstrated the feasibility of the Aerosol Deposition (AD) method which can be adapted as a future fabrication process for flexible electronic devices. On the basis of this method's noticeable advantages such as room-temperature processing, suitability for mass production, wide material selectivity, and direct fabrication on a flexible substrate, we fabricated and evaluated a flexible conductive bridge random access memory (CBRAM) to confirm the feasibility of this method. The CBRAM was fabricated by the AD-method, and a novel film formation mechanism was observed and analyzed. Considering that the analyzed film formation mechanism is notably different with previously reported for film formation mechanisms of the AD method, these results of study will provide strong guidance for the fabrication of flexible electronic device on ductile substrate.

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