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J Nanosci Nanotechnol. 2018 Sep 1;18(9):6404-6409. doi: 10.1166/jnn.2018.15675.

Fabrication of Aluminum-Based Thermal Radiation Plate for Thermoelectric Module Using Aluminum Anodic Oxidization and Copper Electroplating.

Author information

1
School of Materials Science and Engineering, Kyungpook National University, Daegu 41566, Korea.
2
Powder and Ceramic Materials Division, Korea Institute of Materials Science, Changwon 51508, Korea.
3
Department of Chemical Engineering, College of Engineering, Wonkwang University, Iksan 54538, Korea.

Abstract

In this study, electrolytic etching, anodic oxidation, and copper electroplating were applied to aluminum to produce a plate on which a copper circuit for a thermoelectric module was formed. An oxide film insulating layer was formed on the aluminum through anodic oxidation, and platinum was coated by sputtering to produce conductivity. Finally, copper electroplating was performed directly on the substrate. In this structure, the copper plating layer on the insulating layer served as a conductive layer in the circuit. The adhesion of the copper plating layer was improved by electrolytic etching. As a result, the thermoelectric module fabricated in this study showed excellent adhesion and good insulation characteristics. It is expected that our findings can contribute to the manufacture of plates applicable to thermoelectric modules with high dissipation performance.

PMID:
29677804
DOI:
10.1166/jnn.2018.15675

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