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ACS Appl Mater Interfaces. 2017 Nov 22;9(46):40801-40809. doi: 10.1021/acsami.7b11485. Epub 2017 Nov 7.

Graphene-Carbon-Metal Composite Film for a Flexible Heat Sink.

Author information

1
Applied Quantum Composites Research Center, Korea Institute of Science and Technology , Chudong-ro 92, Bongdong-eup, Wanju, Jeollabuk-do 55324, Republic of Korea.
2
Department of Advanced Chemicals & Engineering, Chonnam National University , 77, Yongbong-ro, Buk-gu, Gwangju 61186, Republic of Korea.
3
Division of Nano Information Technology (Nanomaterials Science and Engineering), KIST School, Korea University of Science and Technology (UST) , 5, Hwarang-ro 14-gil, Seongbuk-gu, Seoul 02792, Republic of Korea.

Abstract

The heat generated from electronic devices such as light emitting diodes (LEDs), batteries, and highly integrated transistors is one of the major causes obstructing the improvement of their performance and reliability. Herein, we report a comprehensive method to dissipate the generated heat to a vast area by using the new type of graphene-carbon-metal composite film as a heat sink. The unique porous graphene-carbon-metal composite film that consists of an electrospun carbon nanofiber with arc-graphene (Arc-G) fillers and an electrochemically deposited copper (Cu) layer showed not only high electrical and thermal conductivity but also high mechanical stability. Accordingly, superior thermal management of LED devices to that of conventional Cu plates and excellent resistance stability during the repeated 10 000 bending cycles has been achieved. The heat dissipation of LEDs has been enhanced by the high heat conduction in the composite film, heat convection in the air flow, and thermal radiation at low temperature in the porous carbon structure. This result reveals that the graphene-carbon-metal composite film is one of the most promising materials for a heat sink of electronic devices in modern electronics.

KEYWORDS:

composite; electroplating; electrospinning; graphene; heat sink

PMID:
29064660
DOI:
10.1021/acsami.7b11485

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