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Sci Rep. 2017 May 2;7:43664. doi: 10.1038/srep43664.

Enhanced stability of filament-type resistive switching by interface engineering.

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SUTD-MIT International Design Center (IDC), Singapore University of Technology and Design (SUTD), 8 Somapah road, 487372, Singapore.
Shanghai Key Laboratory of Multidimensional Information Processing, Department of Electrical Engineering, East China Normal University, Shanghai, 200241, China.


The uncontrollable rupture of the filament accompanied with joule heating deteriorates the resistive switching devices performance, especially on endurance and uniformity. To suppress the undesirable filaments rupture, this work presents an interface engineering methodology by inducing a thin layer of NiOx into a sandwiched Al/TaOx/ITO resistive switching device. The NiOx/TaOx interface barrier can confine the formation and rupture of filaments throughout the entire bulk structure under critical bias setups. The physical mechanism behind is the space-charge-limited conduction dominates in the SET process, while the Schottky emission dominates under the reverse bias.

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