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Nanoscale Res Lett. 2017 Dec;12(1):300. doi: 10.1186/s11671-017-2046-4. Epub 2017 Apr 26.

Anisotropy of Single-Crystal Silicon in Nanometric Cutting.

Author information

1
School of Mechatronics Engineering, Harbin Institute of Technology, Harbin, 150001, People's Republic of China. wzg1977sohu@163.com.
2
School of Mechatronics Engineering, Harbin Institute of Technology, Harbin, 150001, People's Republic of China. chenjiaxuan@hit.edu.cn.
3
College of Mechanical Engineering, Tianjin University of Technology, Tianjin, 300384, People's Republic of China.
4
School of Mechatronics Engineering, Harbin Institute of Technology, Harbin, 150001, People's Republic of China.

Abstract

The anisotropy exhibited by single-crystal silicon in nanometric cutting is very significant. In order to profoundly understand the effect of crystal anisotropy on cutting behaviors, a large-scale molecular dynamics model was conducted to simulate the nanometric cutting of single-crystal silicon in the (100)[0-10], (100)[0-1-1], (110)[-110], (110)[00-1], (111)[-101], and (111)[-12-1] crystal directions in this study. The simulation results show the variations of different degrees in chip, subsurface damage, cutting force, and friction coefficient with changes in crystal plane and crystal direction. Shear deformation is the formation mechanism of subsurface damage, and the direction and complexity it forms are the primary causes that result in the anisotropy of subsurface damage. Structurally, chips could be classified into completely amorphous ones and incompletely amorphous ones containing a few crystallites. The formation mechanism of the former is high-pressure phase transformation, while the latter is obtained under the combined action of high-pressure phase transformation and cleavage. Based on an analysis of the material removal mode, it can be found that compared with the other crystal direction on the same crystal plane, the (100)[0-10], (110)[-110], and (111)[-101] directions are more suitable for ductile cutting.

KEYWORDS:

Anisotropy behavior; Chip; Molecular dynamics simulation; Nanometric cutting; Single-crystal silicon; Subsurface damage

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