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Adv Mater. 2016 Oct;28(38):8371-8378. doi: 10.1002/adma.201602339. Epub 2016 Jul 20.

Simultaneous Roll Transfer and Interconnection of Flexible Silicon NAND Flash Memory.

Author information

1
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 305-701, Republic of Korea.
2
Department of Nano Mechanics, Nano-Convergence Mechanical Systems Research Division, Korea Institute of Machinery and Materials (KIMM), 156 Gajeongbuk-ro, Yuseong-gu, Daejeon, 305-343, Republic of Korea.
3
Department of Nano Mechanics, Nano-Convergence Mechanical Systems Research Division, Korea Institute of Machinery and Materials (KIMM), 156 Gajeongbuk-ro, Yuseong-gu, Daejeon, 305-343, Republic of Korea. jaehkim@kimm.re.kr.
4
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 305-701, Republic of Korea. keonlee@kaist.ac.kr.

Abstract

Ultrathin silicon-based flexible 16 × 16 NAND flash memory (f-NAND) is demonstrated utilizing roll-to-plate packaging. The roll-based thermo-compression bonding of the anisotropic conductive film (ACF) transfers and simultaneously interconnects the f-NAND on a flexible printed circuit board. Reliable circuitry operation of the 16 × 16 f-NAND is confirmed with excellent flexibility and stable ACF interconnections.

KEYWORDS:

flexible ACF packaging; flexible NAND flash memory; roll-to-plate technology; ultrathin silicon-based flexible electronics

PMID:
27435480
DOI:
10.1002/adma.201602339

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