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Sci Rep. 2015 Nov 10;5:16133. doi: 10.1038/srep16133.

High Fidelity Tape Transfer Printing Based On Chemically Induced Adhesive Strength Modulation.

Author information

1
Materials Science and Engineering Program, University of Houston, Houston, TX, 77204 USA.
2
Department of Mechanical Engineering, University of Houston, Houston, TX, 77204 USA.
3
Institute of Solid Mechanics, Beihang University, Beijing, 100191, China.
4
Department of Biomedical Engineering, University of Houston, Houston, TX, 77204 USA.
5
MOE Key Laboratory for Nonequilibrium Synthesis and Modulation of Condensed Matter, School of Science, Xi'an Jiaotong University, Xi'an, Shaanxi, 710049, China.
6
Department of Engineering Mechanics and Soft Matter Research Center, Zhejiang University, Hangzhou, Zhejiang, 310027, China.
7
Department of Electrical and Computer Engineering, University of Houston, Houston, TX, 77204 USA.

Abstract

Transfer printing, a two-step process (i.e. picking up and printing) for heterogeneous integration, has been widely exploited for the fabrication of functional electronics system. To ensure a reliable process, strong adhesion for picking up and weak or no adhesion for printing are required. However, it is challenging to meet the requirements of switchable stamp adhesion. Here we introduce a simple, high fidelity process, namely tape transfer printing (TTP), enabled by chemically induced dramatic modulation in tape adhesive strength. We describe the working mechanism of the adhesion modulation that governs this process and demonstrate the method by high fidelity tape transfer printing several types of materials and devices, including Si pellets arrays, photodetector arrays, and electromyography (EMG) sensors, from their preparation substrates to various alien substrates. High fidelity tape transfer printing of components onto curvilinear surfaces is also illustrated.

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