Metallurgical and electrochemical characterization of contemporary silver-based soldering alloys

Angle Orthod. 2014 May;84(3):508-15. doi: 10.2319/073013-569.1. Epub 2013 Nov 7.

Abstract

Objective: To investigate the microstructure, hardness, and electrochemical behavior of four contemporary Ag-based soldering alloys used for manufacturing orthodontic appliances.

Materials and methods: The Ag-based alloys tested were Dentaurum Universal Silver Solder (DEN), Orthodontic Solders (LEO), Ortho Dental Universal Solder (NOB), and Silver Solder (ORT). Five disk-shaped specimens were produced for each alloy, and after metallographic preparation their microstructural features, elemental composition, and hardness were determined by scanning electron microscopy with energy-dispersive X-ray (EDX) microanalysis, X-ray diffraction (XRD) analysis, and Vickers hardness testing. The electrochemical properties were evaluated by anodic potentiodynamic scanning in 0.9% NaCl and Ringer's solutions. Hardness, corrosion current (Icorr), and corrosion potential (Ecorr) were statistically analyzed by one-way analysis of variance and Tukey test (α=.05).

Results: EDX analysis showed that all materials belong to the Ag-Zn-Cu ternary system. Three different mean atomic contrast phases were identified for LEO and ORT and two for DEN and NOB. According to XRD analysis, all materials consisted of Ag-rich and Cu-rich face-centered cubic phases. Hardness testing classified the materials in descending order as follows: DEN, 155±3; NOB, 149±3; ORT, 141±4; and LEO, 136±8. Significant differences were found for Icorr of NOB in Ringer's solution and Ecorr of DEN in 0.9% NaCl solution.

Conclusion: Ag-based soldering alloys demonstrate great diversity in their elemental composition, phase size and distribution, hardness, and electrochemical properties. These differences may anticipate variations in their clinical performance.

Publication types

  • Research Support, Non-U.S. Gov't

MeSH terms

  • Copper / chemistry
  • Corrosion
  • Dental Alloys / chemistry*
  • Dental Soldering / methods*
  • Electrochemistry
  • Electron Probe Microanalysis
  • Hardness
  • Humans
  • Materials Testing
  • Metallurgy
  • Microscopy, Electron, Scanning
  • Orthodontic Appliances*
  • Potentiometry
  • Silver / chemistry*
  • Spectrometry, X-Ray Emission
  • Transition Temperature
  • X-Ray Diffraction
  • Zinc / chemistry

Substances

  • Dental Alloys
  • Silver
  • Copper
  • Zinc