Send to

Choose Destination
See comment in PubMed Commons below
J Colloid Interface Sci. 2010 Jul 15;347(2):267-76. doi: 10.1016/j.jcis.2010.03.071. Epub 2010 Apr 3.

Reverse selectivity--high silicon nitride and low silicon dioxide removal rates using ceria abrasive-based dispersions.

Author information

  • 1Department of Chemical & Biomolecular Engineering, Clarkson University, Potsdam, NY 13699, USA.


We show that by adding poly(acrylicacid-co-diallyldimethylammonium chloride), a cationic polymer with a weight average molecular weight of about 4200 g/mole, to ceria-based dispersions, it is possible to achieve a silicon nitride removal rate (RR) of >100 nm/min and a silicon dioxide RR of <2 nm/min at pH 4 and 4 psi down pressure during chemical mechanical polishing. Furthermore, the RRs of the silicon dioxide films can be tuned by varying the polymer to abrasive weight ratio in the dispersion while the nitride RR is unaffected. We also characterized the role of adsorption of this polymer additive on ceria, silica and silicon nitride powders using zeta potential, adsorption isotherms, UV-Vis spectroscopy, contact angle, thermo-gravimetric analysis and friction coefficient measurements. Our results show that the polymer film formed on the ceria particle surface is strongly bound to it, survives use in polishing and appears to control its reactivity with the silicon dioxide surface in conjunction with electrostatic interactions.


LinkOut - more resources

Full Text Sources

Other Literature Sources

PubMed Commons home

PubMed Commons

How to join PubMed Commons

    Supplemental Content

    Full text links

    Icon for Elsevier Science
    Loading ...
    Support Center