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Small. 2008 Aug;4(8):1084-8. doi: 10.1002/smll.200700991.

Nanostructured copper interfaces for enhanced boiling.

Author information

1
Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309, USA.
PMID:
18570277
DOI:
10.1002/smll.200700991
[Indexed for MEDLINE]

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