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Appl Opt. 1999 Mar 1;38(7):1153-8.

Application of modulation measurement profilometry to objects with surface holes.

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Department of Opto-Electronics, Sichuan University, Chengdu, 610064, China.


We present a detailed discussion of how modulation measurement profilometry (MMP) is applied to measuring an object that has holes on its surface. MMP is not based on the conventional three-dimensional profilometry method with structured light triangulation but on modulation measurements; it has the advantage of measuring the surface of a test object by perpendicular projection, that is, the direction of the CCD camera is the same as that of the projecting light, and the wrapped phases need not be calculated. Thus the difficulties from shadows and spatial discontinuities in phase measurement profilometry and Fourier transform profilometry methods do not exist in MMP. Here we measure a wheellike object that is 31.5 mm thick with an outer diameter of 80 mm and an inner diameter of 20 mm. All the object seen with the CCD camera can be measured including the hole. Experimental results prove that this method is useful for three-dimensional profilometry measurement, especially for objects with discontinuous height steps and spatial isolation.

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