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ASAIO J. 2007 Jan-Feb;53(1):65-73.

Thermal Analysis of the PediaFlow pediatric ventricular assist device.

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1
LaunchPoint Technologies, Inc., Goleta, California, USA 93117, USA.

Erratum in

  • ASAIO J. 2007 Mar-Apr;53(2):256.

Abstract

Accurate modeling of heat dissipation in pediatric intracorporeal devices is crucial in avoiding tissue and blood thermotrauma. Thermal models of new Maglev ventricular assist device (VAD) concepts for the PediaFlow VAD are developed by incorporating empirical heat transfer equations with thermal finite element analysis (FEA). The models assume three main sources of waste heat generation: copper motor windings, active magnetic thrust bearing windings, and eddy currents generated within the titanium housing due to the two-pole motor. Waste heat leaves the pump by convection into blood passing through the pump and conduction through surrounding tissue. Coefficients of convection are calculated and assigned locally along fluid path surfaces of the three-dimensional pump housing model. FEA thermal analysis yields a three-dimensional temperature distribution for each of the three candidate pump models. Thermal impedances from the motor and thrust bearing windings to tissue and blood contacting surfaces are estimated based on maximum temperature rise at respective surfaces. A new updated model for the chosen pump topology is created incorporating computational fluid dynamics with empirical fluid and heat transfer equations. This model represents the final geometry of the first generation prototype, incorporates eddy current heating, and has 60 discrete convection regions. Thermal analysis is performed at nominal and maximum flow rates, and temperature distributions are plotted. Results suggest that the pump will not exceed a temperature rise of 2 degrees C during normal operation.

[Indexed for MEDLINE]

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