Digital sequences and a time reversal-based impact region imaging and localization method

Sensors (Basel). 2013 Oct 1;13(10):13356-81. doi: 10.3390/s131013356.

Abstract

To reduce time and cost of damage inspection, on-line impact monitoring of aircraft composite structures is needed. A digital monitor based on an array of piezoelectric transducers (PZTs) is developed to record the impact region of impacts on-line. It is small in size, lightweight and has low power consumption, but there are two problems with the impact alarm region localization method of the digital monitor at the current stage. The first one is that the accuracy rate of the impact alarm region localization is low, especially on complex composite structures. The second problem is that the area of impact alarm region is large when a large scale structure is monitored and the number of PZTs is limited which increases the time and cost of damage inspections. To solve the two problems, an impact alarm region imaging and localization method based on digital sequences and time reversal is proposed. In this method, the frequency band of impact response signals is estimated based on the digital sequences first. Then, characteristic signals of impact response signals are constructed by sinusoidal modulation signals. Finally, the phase synthesis time reversal impact imaging method is adopted to obtain the impact region image. Depending on the image, an error ellipse is generated to give out the final impact alarm region. A validation experiment is implemented on a complex composite wing box of a real aircraft. The validation results show that the accuracy rate of impact alarm region localization is approximately 100%. The area of impact alarm region can be reduced and the number of PZTs needed to cover the same impact monitoring region is reduced by more than a half.

Publication types

  • Research Support, Non-U.S. Gov't

MeSH terms

  • Aircraft / instrumentation*
  • Algorithms*
  • Equipment Design
  • Equipment Failure Analysis / instrumentation*
  • Manufactured Materials / analysis*
  • Micro-Electrical-Mechanical Systems / instrumentation*
  • Signal Processing, Computer-Assisted / instrumentation*
  • Transducers*