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Items: 5

1.

Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper.

Wen LG, Roussel P, Pedreira OV, Briggs B, Groven B, Dutta S, Popovici MI, Heylen N, Ciofi I, Vanstreels K, Østerberg FW, Hansen O, Petersen DH, Opsomer K, Detavernie C, Wilson CJ, Elshocht SV, Croes K, Bömmels J, Tőkei Z, Adelmann C.

ACS Appl Mater Interfaces. 2016 Sep 21. [Epub ahead of print]

PMID:
27598509
2.

Soft, comfortable polymer dry electrodes for high quality ECG and EEG recording.

Chen YH, Op de Beeck M, Vanderheyden L, Carrette E, Mihajlović V, Vanstreels K, Grundlehner B, Gadeyne S, Boon P, Van Hoof C.

Sensors (Basel). 2014 Dec 10;14(12):23758-80. doi: 10.3390/s141223758.

3.

Effect of pore structure of nanometer scale porous films on the measured elastic modulus.

Vanstreels K, Wu C, Gonzalez M, Schneider D, Gidley D, Verdonck P, Baklanov MR.

Langmuir. 2013 Sep 24;29(38):12025-35. doi: 10.1021/la402383g. Epub 2013 Sep 16.

PMID:
24032751
4.

Mechanical properties of sintered meso-porous silicon: a numerical model.

Martini R, Depauw V, Gonzalez M, Vanstreels K, Nieuwenhuysen KV, Gordon I, Poortmans J.

Nanoscale Res Lett. 2012 Oct 29;7(1):597. doi: 10.1186/1556-276X-7-597.

5.

Influence of varying porogen loads and different UV cures on low-kappa film characteristics.

Farrell L, Verdonck P, Van Besien E, Ciofi I, Borrello G, Vanstreels K, Mardani S, Baklanov MR.

J Nanosci Nanotechnol. 2011 Sep;11(9):8363-7.

PMID:
22097585

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