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1.

Synthesis of cuprous chloride and simultaneous recovery of Ag and Pd from waste printed circuit boards.

Zhang Z, Zhang FS.

J Hazard Mater. 2013 Oct 15;261:398-404. doi: 10.1016/j.jhazmat.2013.07.057. Epub 2013 Aug 3.

PMID:
23973472
2.

Process development for recovery of copper and precious metals from waste printed circuit boards with emphasize on palladium and gold leaching and precipitation.

Behnamfard A, Salarirad MM, Veglio F.

Waste Manag. 2013 Nov;33(11):2354-63. doi: 10.1016/j.wasman.2013.07.017. Epub 2013 Aug 5.

PMID:
23927928
3.

Generation of copper rich metallic phases from waste printed circuit boards.

Cayumil R, Khanna R, Ikram-Ul-Haq M, Rajarao R, Hill A, Sahajwalla V.

Waste Manag. 2014 Oct;34(10):1783-92. doi: 10.1016/j.wasman.2014.05.004. Epub 2014 Jul 19.

PMID:
25052340
4.

Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment.

Xiu FR, Qi Y, Zhang FS.

Waste Manag. 2015 Jul;41:134-41. doi: 10.1016/j.wasman.2015.02.020. Epub 2015 Mar 20.

PMID:
25802060
5.

Selective recovery of palladium from waste printed circuit boards by a novel non-acid process.

Zhang Z, Zhang FS.

J Hazard Mater. 2014 Aug 30;279:46-51. doi: 10.1016/j.jhazmat.2014.06.045. Epub 2014 Jun 28.

PMID:
25037000
6.

Recovery of copper and lead from waste printed circuit boards by supercritical water oxidation combined with electrokinetic process.

Xiu FR, Zhang FS.

J Hazard Mater. 2009 Jun 15;165(1-3):1002-7. doi: 10.1016/j.jhazmat.2008.10.088. Epub 2008 Oct 31.

PMID:
19056170
7.

Evaluation of gold and silver leaching from printed circuit board of cellphones.

Petter PM, Veit HM, Bernardes AM.

Waste Manag. 2014 Feb;34(2):475-82. doi: 10.1016/j.wasman.2013.10.032. Epub 2013 Dec 9.

PMID:
24332399
8.

Distribution of copper, silver and gold during thermal treatment with brominated flame retardants.

Oleszek S, Grabda M, Shibata E, Nakamura T.

Waste Manag. 2013 Sep;33(9):1835-42. doi: 10.1016/j.wasman.2013.05.009. Epub 2013 Jun 5.

PMID:
23746984
9.

Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill.

Yoo JM, Jeong J, Yoo K, Lee JC, Kim W.

Waste Manag. 2009 Mar;29(3):1132-7. doi: 10.1016/j.wasman.2008.06.035. Epub 2008 Oct 2.

PMID:
18835149
10.

Novel application of the nonmetallic fraction of the recycled printed circuit boards as a toxic heavy metal adsorbent.

Hadi P, Gao P, Barford JP, McKay G.

J Hazard Mater. 2013 May 15;252-253:166-70. doi: 10.1016/j.jhazmat.2013.02.037. Epub 2013 Feb 28.

PMID:
23523907
11.

A new strain for recovering precious metals from waste printed circuit boards.

Ruan J, Zhu X, Qian Y, Hu J.

Waste Manag. 2014 May;34(5):901-7. doi: 10.1016/j.wasman.2014.02.014. Epub 2014 Mar 11.

PMID:
24630215
12.

Recovery of metals from waste printed circuit boards by supercritical water pre-treatment combined with acid leaching process.

Xiu FR, Qi Y, Zhang FS.

Waste Manag. 2013 May;33(5):1251-7. doi: 10.1016/j.wasman.2013.01.023. Epub 2013 Mar 7.

PMID:
23474342
13.

Chemical and biological processes for multi-metal extraction from waste printed circuit boards of computers and mobile phones.

Shah MB, Tipre DR, Dave SR.

Waste Manag Res. 2014 Nov;32(11):1134-41. doi: 10.1177/0734242X14550021. Epub 2014 Oct 2.

PMID:
25278513
14.

Oxidative leaching process with cupric ion in hydrochloric acid media for recovery of Pd and Rh from spent catalytic converters.

Nogueira CA, Paiva AP, Oliveira PC, Costa MC, da Costa AM.

J Hazard Mater. 2014 Aug 15;278:82-90. doi: 10.1016/j.jhazmat.2014.05.099. Epub 2014 Jun 7.

PMID:
24953939
15.

Recycling of WEEE: characterization of spent printed circuit boards from mobile phones and computers.

Yamane LH, de Moraes VT, Espinosa DC, Tenório JA.

Waste Manag. 2011 Dec;31(12):2553-8. doi: 10.1016/j.wasman.2011.07.006. Epub 2011 Aug 5.

PMID:
21820883
16.

Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation.

Fogarasi S, Imre-Lucaci F, Imre-Lucaci A, Ilea P.

J Hazard Mater. 2014 May 30;273:215-21. doi: 10.1016/j.jhazmat.2014.03.043. Epub 2014 Mar 30.

PMID:
24747374
17.

Leaching copper from shredded particles of waste printed circuit boards.

Yang H, Liu J, Yang J.

J Hazard Mater. 2011 Mar 15;187(1-3):393-400. doi: 10.1016/j.jhazmat.2011.01.051. Epub 2011 Jan 18.

PMID:
21300436
18.

Size-controlled preparation of Cu2O nanoparticles from waste printed circuit boards by supercritical water combined with electrokinetic process.

Xiu FR, Zhang FS.

J Hazard Mater. 2012 Sep 30;233-234:200-6. doi: 10.1016/j.jhazmat.2012.07.019. Epub 2012 Jul 13.

PMID:
22835773
19.

Effect of silver or copper middle layer on the performance of palladium modified nickel foam electrodes in the 2-chlorobiphenyl dechlorination.

He Z, Sun J, Wei J, Wang Q, Huang C, Chen J, Song S.

J Hazard Mater. 2013 Apr 15;250-251:181-9. doi: 10.1016/j.jhazmat.2013.02.001. Epub 2013 Feb 10.

PMID:
23454456
20.

Environmental impact assessment of hydrometallurgical processes for metal recovery from WEEE residues using a portable prototype plant.

Rocchetti L, Vegliò F, Kopacek B, Beolchini F.

Environ Sci Technol. 2013 Feb 5;47(3):1581-8. doi: 10.1021/es302192t. Epub 2013 Jan 25.

PMID:
23323842
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