Chemical activation of commodity plastics for patterned electroless deposition of robust metallic films

Jessica R Wagner; Jared Fletcher; Stephen A Morin

doi:10.1039/d2cc03848j

Chemical activation of commodity plastics for patterned electroless deposition of robust metallic films

Chem Commun (Camb). 2022 Sep 15;58(74):10337-10340. doi: 10.1039/d2cc03848j.

Authors

Jessica R Wagner¹, Jared Fletcher¹, Stephen A Morin^{1

2

3}

Affiliations

¹ Department of Chemistry, University of Nebraska-Lincoln, Hamilton Hall, Lincoln, NE 68588, USA. smorin2@unl.edu.
² Nebraska Center for Materials and Nanoscience, University of Nebraska-Lincoln, Lincoln, NE 68588, USA.
³ Nebraska Center for Integrated Biomolecular Communication, University of Nebraska, Lincoln, NE 68588, USA.

PMID: 36039790
DOI: 10.1039/d2cc03848j

Abstract

A general approach to increase the adhesion of metal films to commodity plastic substrates using a metal-chelating polymer, polyethyleneimine, in conjunction with patterned electroless deposition is described. This general fabrication method is compatible with a diverse array of plastics and metals with properties applicable to flexible electronic circuits and electrochemical cells.