Formation and Characterization of Dendritic Interfacial Electrodes inside an Ionomer

Yanjie Wang; Jiayu Liu; Yetao Zhu; Denglin Zhu; Hualing Chen

doi:10.1021/acsami.7b08012

Formation and Characterization of Dendritic Interfacial Electrodes inside an Ionomer

ACS Appl Mater Interfaces. 2017 Sep 13;9(36):30258-30262. doi: 10.1021/acsami.7b08012. Epub 2017 Aug 29.

Authors

Yanjie Wang¹, Jiayu Liu², Yetao Zhu¹, Denglin Zhu¹, Hualing Chen³

Affiliations

¹ School of Mechanical and Electrical Engineering, Hohai University, Changzhou Campus , Changzhou 213022, People's Republic of China.
² Department of Mechanical Engineering, Johns Hopkins University , Baltimore, Maryland 21218, United States.
³ School of Mechanical Engineering, Xi'an Jiaotong University , Xi'an 710049, People's Republic of China.

PMID: 28841281
DOI: 10.1021/acsami.7b08012

Abstract

Formation of dendritic interfacial electrodes (DIEs) between metal/polymer interfaces has high demands in a variety of areas. By combining impregnation electroplating (IEP) step with impregnation-reduction (IR) step under straightforward conditions, we report a novel method of preparation of dendritic interfacial metal electrodes of palladium, platinum, silver and copper inside an ionomer for ionic polymer-metal composites (IPMC) application. The depth of palladium DIEs can be controlled by adjusting the reaction time, and the maximum depth can almost reach up to contact from the both sides of ionomer with a total thickness of 200 μm. The capacitance and actuation performance of IPMC was dramatically enhanced because of the presence of DIEs.

Keywords: actuation; capacitance; dendritic interfacial electrodes (DIEs); ionic polymer−metal composites (IPMC); ionomer; stiffness.