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J Environ Sci (China). 2009;21 Suppl 1:S166-9. doi: 10.1016/S1001-0742(09)60065-6.

Decomposition of poly(amide-imide) film enameled on solid copper wire using atmospheric pressure non-equilibrium plasma.

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  • 1Department of Chemical and Biological Engineering, Hachinohe National College of Technology, Tamonoki, Hachinohe City, 039-1192 Aomori, Japan.
  • 2Department of Applied Chemistry, Faculty of Engineering, Saitama University, 255 Shimo-okubo, Sakura-ku, Saitama City, 338-7589 Saitama, Japan.
  • 3Faculty of Engineering, Saitama Institute of Technology, 1690 Fusaiji, Fukaya City, 369-0293 Saitama, Japan.


The decomposition of a poly(amide-imide) thin film coated on a solid copper wire was attempted using atmospheric pressure non-equilibrium plasma. The plasma was produced by applying microwave power to an electrically conductive material in a gas mixture of argon, oxygen, and hydrogen. The poly(amide-imide) thin film was easily decomposed by argon-oxygen mixed gas plasma and an oxidized copper surface was obtained. The reduction of the oxidized surface with argon-hydrogen mixed gas plasma rapidly yielded a metallic copper surface. A continuous plasma heat-treatment process using a combination of both the argon-oxygen plasma and argon-hydrogen plasma was found to be suitable for the decomposition of the poly(amide-imide) thin film coated on the solid copper wire.

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