Langmuir. 2005 Aug 16;21(17):8058-68.

Stamp collapse in soft lithography.

Huang YY, Zhou W, Hsia KJ, Menard E, Park JU, Rogers JA, Alleyne AG.

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Department of Mechanical and Industrial Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA.

Abstract

We have studied the so-called roof collapse in soft lithography. Roof collapse is due to the adhesion between the PDMS stamp and substrate, and it may affect the quality of soft lithography. Our analysis accounts for the interactions of multiple punches and the effect of elastic mismatch between the PDMS stamp and substrate. A scaling law among the stamp modulus, punch height and spacing, and work of adhesion between the stamp and substrate is established. Such a scaling law leads to a simple criterion against the unwanted roof collapse. The present study agrees well with the experimental data.

PMID:: 16089420; [PubMed]

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